Micron MTFDDAK256MAM-1K1 Datasheet Page 9

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Electrical Characteristics
Stresses greater than those listed may cause permanent damage to the device. This is a
stress rating only, and functional operation of the device at these or any other condi-
tions above those indicated in the operational sections of this specification is not im-
plied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
Table 9: SATA Power Consumption
Density Idle Average Active Average
Sequential Write/Read Maximum
(128k transfer) Unit
128GB <85 150 3500 2000 mW
256GB <85 160 4000 2200 mW
512GB <100 280 5500 2500 mW
Notes:
1. Data taken at 25°C using a 6 Gb/s SATA interface.
2. Active average power measured while running MobileMark
®
2007 Productivity Suite.
3. DIPM (device-initiated power management) enabled.
4. Sequential power measured in IOMETER MAX with 128KB transfer size.
Table 10: Maximum Ratings
Parameter/Condition Symbol Min Max Unit
Voltage input V5 4.5 5.5 V
Operating temperature T
C
0 70 °C
Non-operating temperature –40 85 °C
Rate of temperature change 20 °C/hour
Relative humidity (non-condensing) 5 95 %
Note:
1. Temperature is best measured with a thermocouple attached to the center point of the
exterior of the case on the cast side (side where the SATA connector is visible). Contact
with the drive label is acceptable.
Table 11: Shock and Vibration
Parameter/Condition Specification
Operating shock 1500 G/1.0ms
Operating vibration 2–500Hz at 3.1G
C400 2.5-Inch NAND Flash SSD
Electrical Characteristics
PDF: 09005aef8455a0a5
realssd_c400_2_5.pdf - Rev. D 09/11 EN
9
Micron Technology, Inc. reserves the right to change products or specifications without notice.
© 2011 Micron Technology, Inc. All rights reserved.
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