Micron MT36KSF2G72PZ-1G6E1 Datasheet

DDR4 SDRAM RDIMMMTA36ASF2G72PZ – 16GBFeatures• DDR4 functionality and operations supported asdefined in the component data sheet• 288-pin, registered

Table 7: Component-to-Module DQ Map Back (Continued)ComponentReferenceNumberComponentDQ Module DQModule PinNumberComponentReferenceNumberComponentDQ M

Functional Block DiagramFigure 2: Functional Block DiagramDQ DQ DQ DQ ZQDQ0 DQ1 DQ2 DQ3 VssDQ DQ DQ DQU1U29DQ DQ DQ DQ ZQDQ4 DQ5 DQ6 DQ7 VssDQ DQ DQ D

General DescriptionHigh-speed DDR4 SDRAM modules use DDR4 SDRAM devices with two or four internalmemory bank groups. DDR4 SDRAM modules utilizing 4- a

Address Mapping to DRAMAddress MirroringTo achieve optimum routing of the address bus on DDR4 multi rank modules, the ad-dress bus will be wired as sh

To reduce the electrical load on the host memory controller's command, address, andcontrol bus, Micron's RDIMMs utilize a DDR4 registering c

Temperature Sensor With SPD EEPROM OperationThermal Sensor OperationsThe integrated thermal sensor continuously monitors the temperature of the module

Electrical SpecificationsStresses greater than those listed may cause permanent damage to the module. This is astress rating only, and functional oper

Table 11: Thermal CharacteristicsSymbol Parameter/Condition Value Units NotesTCCommercial operating case temperature 0 to 85 °C 1, 2, 3>85 to 95 °C

DRAM Operating ConditionsRecommended AC operating conditions are given in the DDR4 component data sheets.Component specifications are available at mic

IDD SpecificationsTable 13: DDR4 IDD Specifications and Conditions – 16GB (Die Revision A)Values are for the MT40A1G4 DDR4 SDRAM only and are computed

Table 2: AddressingParameter 16GBRow address 64K A[15:0]Column address 1K A[9:0]Device bank group address 4 BG[1:0]Device bank address per group 4 BA[

Registering Clock Driver SpecificationsTable 14: Registering Clock Driver Electrical CharacteristicsDDR4 RCD01 devices or equivalentParameter Symbol P

Temperature Sensor With SPD EEPROMThe temperature sensor continuously monitors the module's temperature and can beread back at any time over the

Module DimensionsFigure 3: 288-Pin DDR4 RDIMM31.40 (1.236)31.10 (1.224)2.50 (0.098) D(2X)0.75 (0.03) R(8X)Front view133.48 (5.255)133.22 (5.244)Back v

Pin AssignmentsThe pin assignment table below is a comprehensive list of all possible pin assignmentsfor DDR4 RDIMM modules. See Functional Block Diag

Table 4: Pin Assignments (Continued)288-Pin DDR4 RDIMM Front 288-Pin DDR4 RDIMM BackPin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol Pin Symbol

Pin DescriptionsThe pin description table below is a comprehensive list of all possible pins for DDR4modules. All pins listed may not be supported on

Table 5: Pin Descriptions (Continued)Symbol Type DescriptionODTx Input On-die termination: ODT (registered HIGH) enables termination resistance intern

Table 5: Pin Descriptions (Continued)Symbol Type DescriptionTDQS_tTDQS_c(x8 DRAM-basedRDIMM only)Output Termination data strobe: When enabled via the

DQ MapTable 6: Component-to-Module DQ Map FrontComponentReferenceNumberComponentDQ Module DQModule PinNumberComponentReferenceNumberComponentDQ Module

Table 6: Component-to-Module DQ Map Front (Continued)ComponentReferenceNumberComponentDQ Module DQModule PinNumberComponentReferenceNumberComponentDQ