Micron MT36KSF2G72PZ-1G6E1 Datasheet download pdf (Page 16)

Electrical Specifications

Stresses greater than those listed may cause permanent damage to the module. This is a

stress rating only, and functional operation of the module at these or any other condi-

tions outside those indicated in each device's data sheet is not implied. Exposure to ab-

solute maximum rating conditions for extended periods may adversely affect reliability.

Table 9: Absolute Maximum Ratings

Symbol Parameter Min Max Units Notes

supply voltage relative to V

–0.4 1.5 V 1

DDQ

supply voltage relative to V

–0.4 1.5 V 1

Voltage on V

pin relative to V

–0.4 3.0 V 2

, V

OUT

Voltage on any pin relative to V

–0.4 1.5 V

Table 10: Operating Conditions

Symbol Parameter Min Nom Max Units Notes

supply voltage 1.14 1.20 1.26 V 1

DRAM activating power supply 2.375 2.5 2.75 V 2

REFCA(DC)

Input reference voltage –

command/address bus

0.49 × V

0.5 × V

0.51 × V

V 3

VTT

Termination reference current from V

–750 – 750 mA

Termination reference voltage (DC) –

command/address bus

0.49 × V

20mV

0.5 × V

0.51 × V

20mV

V 4

Input leakage current; any input excluding ZQ; 0V <

< 1.1V

– – – µA 5

Input leakage current; ZQ –3 – 3 µA 6, 7

I/O

DQ leakage; 0V < V

< V

–4 – 4 µA 7

OZpd

Output leakage current; V

OUT

= V

; DQ is disabled – – 5 µA

OZpu

Output leakage current; V

OUT

= V

; DQ and ODT

are disabled; ODT is disabled with ODT input HIGH

– – 50 µA

VREFCA

REFCA

leakage; V

REFCA

= V

/2 (after DRAM is ini-

tialized)

–2 – 2 µA 7

Notes:

1. V

DDQ

balls on DRAM are tied to V

2. V

must be greater than or equal to V

at all times.

3. V

REFCA

must not be greater than 0.6 × V

. When V

is less than 500mV, V

REF

may be

less than or equal to 300mV.

4. V

termination voltages in excess of specification limit adversely affect command and

address signals' voltage margins and reduce timing margins.

5. Command and address inputs are terminated to V

/2 in the registering clock driver. In-

put current is dependent on termination resistance set in the registering clock driver.

6. Tied to ground. Not connected to edge connector.

7. Multiply by number of DRAM die on module.

16GB (x72, ECC, DR) 288-Pin DDR4 RDIMM

Electrical Specifications

PDF: 09005aef84f8c349

asf36c2gx72pz.pdf - Rev. F 2/15 EN

Micron Technology, Inc. reserves the right to change products or specifications without notice.

1 2 ... 11 12 13 14 15 16 17 18 19 20 21 22

Comments to this Manuals

No comments

Micron MT36KSF2G72PZ-1G6E1 Datasheet Page 16

Comments to this Manuals

Related products and manuals for Memory modules Micron MT36KSF2G72PZ-1G6E1